New Glue Could make Microprocessors 1000x More Powerful

IBM and 3M are working on a new type of adhesive to glue computer processors together into stacks. If they can make it happen, this could mean an entirely new generation of chips which are a thousand times more powerful than anything we have now. See the video after the break.

IBM and 3M are partnering up to solve the cooling problem using a new type of heat-conducting adhesive to make stacked chips like a layer cake. Continue reading